According to Custom Market Insights (CMI), the Global Electronics Adhesive Market size was estimated at USD 4.08 Billion in 2021 and is expected to hit around USD 6.08 Billion by 2030, poised to grow at a compound annual growth rate (CAGR) of 7.53 % from 2022 to 2030.
Electronics adhesive provides a strong bond or adhesion during electronic assembly. These adhesives are ideal components for electrical interconnects, thermal, and structural bonding applications. In addition, electronic adhesive offers the reliability of electronic components. Furthermore, electronic adhesives are mainly used in surface-mounting, assembling substrates on PCBs and semiconductors, potting & encapsulations, and manufacturing & assembly of electronic circuits and products.
Browse the full “Electronics Adhesive Market Size, Trends and Insights By Product Type (Thermal Conductive, Electrically Conductive, UV Curing, Others), By Application (Surface-mount devices, Potting & Encapsulation, Conformal Coatings, Others, Industrial), and By Region – Global Industry Overview, Statistical Data, Competitive Analysis, Share Outlook, and Forecast 2022–2030” report at ReportURL
Robust demand from the electronics industry
The technological advancement, upgradation, and miniaturization in new product developments spurring electronics components, and the OEM manufacturing industry have enhanced the performance of electronics adhesive during the forecast period. In response to this, the growing demand for touch screens, displays, medical electronics systems, automation of mobile devices, and medical devices are driving the electronics adhesive market in upcoming years. In addition, advancement in electronic components is also likely to act as one of the key factors for the global electronic adhesive market.
According to data published by, Invest India in 2020, electronic Component production rises by $4 bn in 4 years from 2014 to 2018. These factors are expected to create new avenues for the e-adhesive. These factors are likely to act as one of the key drivers responsible for the growth of the electronic adhesive market.
Disadvantages associated with electronics adhesives
However, electronic adhesive requires low temperature for curing and it usually takes a long time compared to the traditional soldering method. In addition, the availability of alternative cost-effective substitutes for electronic adhesives is expected to decrease the demand and production capacities for electronic adhesives.
Growing demand for electronic-based devices
The growth of the electronics adhesive market is driven by growing demand for consumer wearable electronic devices, medical equipment, computers, PCB, laptop, LED, and among many others that are expected to create the need for electronic adhesive. It is extensively used for potting, encapsulating, sealing, coating, and bonding. These factors are key market trends for the electronics adhesive market.
Furthermore, several key companies are actively engaged in the manufacturing of cost-effective electronics adhesives where thermally and electrically based electronics adhesives are widely employed in the various end-use industry. These factors collectively witnessed high potential growth for electronics adhesive; thus, offering remunerative opportunities for the market.
Miniaturization of devices
There is a growing trend for the miniaturization of electronic devices which in turn leads to the requirement for high-performance adhesive. Furthermore, fluctuation in the prices of raw materials, high costs associated with installment, and innovative equipment are expected to may act as one the challenging factors during the forecast period.
On the basis of product type, the market is segmented into thermal conductive and electrically conductive.
The thermal conductive segment dominated the market in 2021 and is expected to grow over the forecast period and was valued at 1.39 billion in 2021.
The thermally conductive-based electronics adhesive is mainly formulated with silicone, epoxy, resins, and acrylic adhesives. With upgradation in the thermal conductive properties, electronic adhesive finds application in chip-scale packaging, power semiconductors, PCB, and other electronic devices. Additionally, electronic devices have successfully replaced traditional soldering systems. These factors are expected to boost the market in the upcoming years.
On the basis of application, the segment includes surface-mount devices (chip bonding) potting & encapsulation, conformal coatings, industrial, and others. It is expected that the global surface-mount devices application segment to hold a dominant position during 2022 -2030 with a total share of 44.78%.
Growing demand for electric vehicles, consumer demand for electronic gadgets, electrically based household appliances, and government support for the electrical industry have escalated the electronic adhesive market during the forecast period. Additionally, electronic adhesives act as hardening agents, which are mainly used to fix the component on the printed board.
Region-wise, the market is studied across North America, Europe, Asia-Pacific, and LAMEA.
Asia-Pacific is the dominant region in the electronics adhesive market. This region is also anticipated to maintain its dominance throughout the forecast period, with a total market share of 40.78%. Countries such as China, India, Japan, South Korea, and others have a good presence in the electrical & electronics industry due to which will create the need for electronics adhesive for surface mounting and encapsulation of semiconductor and PCB components.
Furthermore, India has received FDI inflows of $ 88.94 bn in Computer Software and Hardware from April 2000 to June 2022 such government support for the electronics industry is expected to foster the market in upcoming years. In addition, countries such as Japan and Taiwan are constantly engaged in expanding their electrical & automation manufacturing output, where different types of electronics adhesives are widely employed as a protecting material in various electrical & electronic products. For instance, according to a report published by Hennessy Funds, Japan accounts for around 30% market for supplying factory automation products in the world. These factors are escalating the demand for electronics adhesive in the Asia-Pacific region.
|Feature of the Report||Details|
|Market Size in 2021||USD 4.08 Billion|
|Projected Market Size in 2030||USD 6.08 Billion|
|Market Size in 2022||USD (2022Value) Billion/Million|
|CAGR Growth Rate||7.53 % CAGR|
|Prominent Players||3M, Dymax Corporation, DOW Chemical Company, Henkel AG & Co. KGaA, H.B. Fuller Company (Royal Adhesives & Sealants LLC), Evonik Industries AG, Sika AG, Bostik AG, ThreeBond, Shin Etsu Silicones, Konishi Co LTD., TERAOKA SEISAKUSHO CO. LTD., TOMOEGAWA, YAMATO Co. Ltd, and Others|
|Key Segment||By Product Type, Application, and Region|
|Report Coverage||Revenue Estimation and Forecast, Company Profile, Competitive Landscape, Growth Factors, and Recent Trends|
|Regional Scope||North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America|
|Buying Options||Request tailored purchasing options to fulfill your requirements for research.|
Key Market Players in the Electronics Adhesive Market
- Dymax Corporation
- DOW Chemical Company
- Henkel AG & Co. KGaA
- B. Fuller Company (Royal Adhesives & Sealants LLC)
- Evonik Industries AG
- Sika AG
- Bostik AG
- Shin Etsu Silicones
- Konishi Co LTD.
- TERAOKA SEISAKUSHO CO. LTD.
- YAMATO Co. Ltd.
- The thermally conductive product type segment is valued at 1.39 billion in 2021 and is expected to maintain a dominant position during the forecast period.
- Surface-mount devices, application segment is to hold a dominant position during 2022 -2030 and grow at a CAGR of 44.78% during the forecast period.
- Asia-Pacific is the dominant region in the nano-metal oxide market and growing at a CAGR of 40.78%.
Segments covered in the report
By Product Type
- Thermal Conductive
- Electrically Conductive
- UV Curing
- Surface-mount devices
- Potting & Encapsulation
- Conformal Coatings
- The U.S.
- The UK
- Rest of Europe
- South Korea
- Rest of Asia Pacific
The Middle East & Africa
- Saudi Arabia
- South Africa
- Rest of the Middle East & Africa
- Rest of Latin America